FFKM O-Rings
Our FFKM O-Rings are tested under various corrosive environments. Test results show significantly lower corrosion compared to Chemrez, while providing reliable sealing for advanced semiconductor processes.
Features & Benefits:
- Designed for CVD and Etch applications
- Kalrez® equivalent performance
- High resistance to NF3
- Excellent chemical resistance
- Unique bonding structure
- Low compression set
- Max operating temperature: 250 °C
Product Highlights
LOWER COST
SUPERIOR PERFORMANCE
Specifications
| Specification | S705 | S505E |
|---|---|---|
| Kalrez Equivalent | K9100 | - |
| Color | White | White |
| Hardness | 74 | 82 |
| Tensile Strength (MPa) | 11.4 | 14.1 |
| Elongation (%) | 195 | 260 |
| Modulus @ 100% (MPa) | 4.8 | 5.1 |
| Compression Set (72h @ 200°C) | 24.2 | 32.1 |
| Max Service Temperature | 250°C | 250°C |
Test results from customer site indicate S705 has significantly better corrosion resistance than Chemrez.
1) Tool / Process / Wafer size – Mattson Paradigm / Ashing / 300mm
2) Test Period – 2012.03–2012.04 (1PM, RF 350 TIME)
3) Seal Locations / Sizes – Multiple locations (Total 11 parts)
Surface Comparison
| S705 | K9100 | |
|---|---|---|
| Normal Surface |  |
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| Microscope ×50 |  |
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| Microscope ×50 (Cross-section) |  |
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* S705 shows significantly lower etch rate against plasma and chemical attack.
Thermo-Gravimetric Analysis (TGA) – S705
Thermogravimetric analysis measures weight changes in materials as a function of temperature or time under controlled atmosphere—commonly used to evaluate thermal stability and composition.
